JPS6112683Y2 - - Google Patents
Info
- Publication number
- JPS6112683Y2 JPS6112683Y2 JP1869480U JP1869480U JPS6112683Y2 JP S6112683 Y2 JPS6112683 Y2 JP S6112683Y2 JP 1869480 U JP1869480 U JP 1869480U JP 1869480 U JP1869480 U JP 1869480U JP S6112683 Y2 JPS6112683 Y2 JP S6112683Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- metal case
- resin
- electronic component
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 229920002050 silicone resin Polymers 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1869480U JPS6112683Y2 (en]) | 1980-02-15 | 1980-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1869480U JPS6112683Y2 (en]) | 1980-02-15 | 1980-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56121292U JPS56121292U (en]) | 1981-09-16 |
| JPS6112683Y2 true JPS6112683Y2 (en]) | 1986-04-19 |
Family
ID=29614989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1869480U Expired JPS6112683Y2 (en]) | 1980-02-15 | 1980-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112683Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60254643A (ja) * | 1984-05-31 | 1985-12-16 | Toshiba Corp | 樹脂封止型半導体装置 |
-
1980
- 1980-02-15 JP JP1869480U patent/JPS6112683Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56121292U (en]) | 1981-09-16 |
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